MWC2024 | Gosuncn RichLink collaborates with ASR Microelectronics to expand the global market.
On February 26, 2024, Barcelona, Spain. The MWC Barcelona 2024 event kicks off, with the theme of "Future First". This exhibition gathers the giants and innovative enterprises of the global digital industry to share and exchange the latest development insights, viewpoints and innovative achievements of the industry, revealing the technological direction and market trends for the future.
Joining hands with ASR Microelectronics, GOSUNCN RICHLINK accelerates the expansion in the fields of ICV and mobile communications with customers and partners from Europe, America, and Asia, and embraces the global digital opportunities in the industry!
As a leading global wireless semiconductor company, ASR Microelectronics's complete range of wireless communication chip products has been widely used in various fields of the IoT, and ranks among the top in the 4G chip market. Based on ASR Microelectronics's series of high-performance cellular IoT chip solutions, GOSUNCN RICHLINK has launched a rich array of IoT and ICV products in recent years and promoted them to overseas markets. In this exhibition, GOSUNCN RICHLINK's "ASR Chip" product family was gathered at the ASR booth for the first time, and was introduced to industry customers in various fields.
Based on the ASR1803 (LTE Cat.4) and ASR1603 (LTE Cat.1) chip platforms, GOSUNCN RICHLINK showcased its industrial module series (GM520, GM320, GM196) and Telematics tracker series (GT115, GD302). Currently, the IoT and Telematics products integrated by GOSUNCN RICHLINK with ASR's series of chips have been widely used in multiple fields such as smart energy, industrial IoT, Telematics, smart retail, and mobile payments.
With the 2G/3G network sunset process of major global mobile communication operators, 4G will play a crucial role in the future. According to the prediction of the professional consulting agency TSR, the global market's LTE Cat.1/Bis module shipments will reach about 300 million units in 2029, and the LTE Cat.4 module will also maintain a market size of 100 million units for a long time. High-performance, highly reliable, and high-quality 4G chips, modules, and terminal products will give rise to more industry innovative applications and open up a broader market space.
TSR, 2023 Cellular Broadband Device & Module Market
5G sets sail for a new voyage, and ASR showcased the ASR1903 5G RedCap chip for the first time. 2024 will be the first year for 5G RedCap to move towards commercial use. In the 5G era, the industry still holds high expectations for the tremendous potential of "Chinese chips". GOSUNCN RICHLINK will collaborate with ASR to continue to explore in the direction of 5G NR/RedCap and welcome the arrival of the 5G IoT era.
At the exhibition site, Feng Zilong, vice president of ASR, expressed full confidence in the cooperation between the two sides: "ASR will continue to closely collaborate with GOSUNCN RICHLINK, give full play to their respective advantages, face the broad global market, continue to make breakthroughs, and work together for a win-win situation!"
Lu Zhao, the deputy general manager of GOSUNCN RICHLINK, said: "The high-performance and high-quality chip solution launched by ASR has driven the improvement of the product competitiveness of GOSUNCN RICHLINK, and provided us with wings to take off for creating industry-leading IoT products and global business expansion!"
Future First！As a transformative force, "connectivity" is driving the digital transformation of thousands of industries. Standing at the forefront of the industry, GOSUNCN RICHLINK has always worked with ASR and many partners to focus on cellular mobile communication technology, focus on the aftermarket Telematics and mobile communication services, create a leading global IoT industry product and service provider, and help customers in various fields achieve business success.
Rich Link to the Colorful World！